hallfasad.blogg.se - Cooler master hyper 212 evo install intel

As a result of the gaps the amount of heat pipes touching the center of the IHS is lower and their surface area is lower, reducing the heat sink's efficiency. Gaps between heat pipes result in uneven heat distribution which can create or worsen hot spots on the CPU. As a result the IHS and CPU below it get cooled more evenly, and more heat pipes can be packed in small space improving cooling performance. Thanks to high precision machinery several heat pipes can be combined into a tightly packed virtual vapor chamber array with a perfectly flat and uniform surface. Includeds a new 120mm PWM fan with anti-vibration rubber pads and a quick snap cover for an easily expedited fan installation. Supports an optional 2nd 120mm fan to increase cooling performance.ġ20mm PWM fam with quick snap fan bracket design Patented CDC™ (Continuous Direct Contact) technology, side-by-side heat pipe configurations with no gaps creating a perfectly smooth surface for heat conduction.Ĭompatible with Intel® LGA2066, LGA2011-v3, LGA2011, LGA1366, LGA1156, LGA1155, LGA1151, LGA1150 & AMD Socket FM1 / FM2 / AM3+ / AM3 / AM2+ / AM2

Versatile all-in-one mounting solution supporting the latest Intel® LGA2066, LGA2011-v3, LGA2011, LGA1366, LGA1156, LGA1155, LGA1151, LGA1150 and AMD AM4, AM3+, AM3, AM2+, AM2, FM2+, FM2, FM1įin optimizations provide perfect balance between high and low speed operationsĪluminum fins with 4 direct contact heat pipes to provide excellent heat dissapation.

Wide-range PWM fan with unique wave-shaped blade design for excellent airflow.

4 Direct Contact heat pipes with the patented CDC™ (Continuous Direct Contact) technology - creating a perfect, sleek surface for heat conduction.

Well-balanced cooling performance provides fin optimizations with perfect balance between high and low speed operations.

The aluminum fin structure has been optimized to provide the perfect performance balance between high and low speed fan operations. Place the standoffs through the board from the top and secure them with a nut as shown below. ( Make sure that the covered feet of bracket are touching the bottom of the board.

Place the back plate on board as shown Below.

This acts as a virtual vapor chamber that dissipates a large amount of heat. Remove the OEM mounting bracket from the motherboard. The Hyper 212 EVO now features four Cooler Master patented Continuous Direct Contact™ (CDC) heat pipes that are tightly packed into a flat array on the CPU Cooler base. The Hyper 212 EVO cooling systems are designed and optimized to provide the best user experience and cooling potential for a new generation of processors.